| 性别 | 不限 | ||
| 人数 | 1人 | ||
| 薪资 | 30-50万元 | ||
| 部门 | 上海某半导体企业 | ||
| 经验 | 八年以上 | ||
| 学历 | 本科 selected | ||
| 地址 | 上海 | ||
| 年龄 | 30-40岁 | ||
| 详情 | Work scope: - Mechanical and thermal stress analysis on package & board level. - Package & board level heat dissipation simulation. - Provide Mechanical simulation for IC package and board structure design. - Optimize package & board structure or design to mitigate cracking related failure from stress, warpage, material, and manufacturing perspective. - Classify stress related failure and accordingly the failure mechanisms Requirements: 1. EE/ME related background in system/chip design, at least 5+ years work experience of Thermal-Mechanical simulation. 2. Solid knowledge and experience on thermal-mechanical modeling, fatigue failure modeling, and heat dissipation simulation 3. Good experience on major FEA tools (e.g. ANSYS, Hypermesh, etc), heat dissipation simulation tools (e.g. Icepak, Flotherm, etc.) and modeling tools (e.g. Solidworks, ProE, etc). 4. Deep understanding of packaging materials (including Core, soldering materials) and the mechanical behaviors. 5. Strong knowledge of electronic packaging structure and process, package qualification experience is a plus. 6. Strong teamwork sense, good learning competency, self-motivated, and ability to work in diverse areas in a flexible and dynamic environment. 来源：上海猎头公司爱博强猎头发布 |
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