芯片结构仿真经理-上海猎头公司爱博强猎头发布-苏州猎头公司-上海猎头公司-杭州猎头公司-南京猎头公司-【爱博强猎头】

Job
招聘职位

性别	不限	人数	1人
部门	上海某半导体企业	经验	八年以上
学历	本科 selected	地址	上海
年龄	30-40岁	薪资	30-50万元
详情	Work scope: - Mechanical and thermal stress analysis on package & board level. - Package & board level heat dissipation simulation. - Provide Mechanical simulation for IC package and board structure design. - Optimize package & board structure or design to mitigate cracking related failure from stress, warpage, material, and manufacturing perspective. - Classify stress related failure and accordingly the failure mechanisms Requirements: 1. EE/ME related background in system/chip design, at least 5+ years work experience of Thermal-Mechanical simulation. 2. Solid knowledge and experience on thermal-mechanical modeling, fatigue failure modeling, and heat dissipation simulation 3. Good experience on major FEA tools (e.g. ANSYS, Hypermesh, etc), heat dissipation simulation tools (e.g. Icepak, Flotherm, etc.) and modeling tools (e.g. Solidworks, ProE, etc). 4. Deep understanding of packaging materials (including Core, soldering materials) and the mechanical behaviors. 5. Strong knowledge of electronic packaging structure and process, package qualification experience is a plus. 6. Strong teamwork sense, good learning competency, self-motivated, and ability to work in diverse areas in a flexible and dynamic environment. 来源：上海猎头公司爱博强猎头发布
	马上应聘

招聘职位